| Issue |
Eur. Phys. J. Appl. Phys.
Volume 43, Number 3, September 2008
Topical Issue ITFPC (Innovations on Thin Films Processing and Characterisation)
|
|
|---|---|---|
| Page(s) | 283 - 288 | |
| Section | Thin Films Processing and Surface Engineering | |
| DOI | https://doi.org/10.1051/epjap:2008070 | |
| Published online | 30 April 2008 | |
https://doi.org/10.1051/epjap:2008070
Surface alloying of metallic substrates with pre-deposited films through a pulsed electron-beam mixing
Institute of High-Current Electronics, 2/3 Academichesky av., Tomsk 634055, Russia
Corresponding author: a_v_batrakov@mail.ru
Received:
16
November
2007
Revised:
29
December
2007
Accepted:
3
March
2008
Published online:
30
April
2008
Microstructure and properties of the surface alloys resulted from a pulsed liquid-phase mixing of metallic substrates with pre-deposited films were studied. As a tool for the liquid-phase mixing, a low-energy (~30 keV), high-current (~30 kA) pulsed (0.8–3 µs) electron beam of energy density ranging from 1 to 15 J cm−2 has been employed. Three immiscible systems (Ta/Fe; Al/Si/Al/Si/Al/Si/Al; Al/C/Al/C/Al) and two systems with different solid solubility of components (Cu/316 stainless steel; Zr/Ti/Ti-6Al-4V) were chosen for the surface alloying investigation.
PACS: 68.35.bd – Metals and alloys / 61.82.Bg – Metals and alloys / 52.59.Mv – High-voltage diodes
© EDP Sciences, 2008
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