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Cited article:

Bond graph multi-physics modeling of encapsulating materials in power electronic modules

Baptiste Trajin, Paul-Etienne Vidal

Eur. Phys. J. Appl. Phys., 89 2 (2020) 20902

Published online: 2020-04-23

DOI: https://doi.org/10.1051/epjap/2020180287

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