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All issues Volume 87 / No 2 (August 2019) Eur. Phys. J. Appl. Phys., 87 2 (2019) 20903 References
Issue
Eur. Phys. J. Appl. Phys.
Volume 87, Number 2, August 2019
Electrical Engineering Symposium (SGE 2018)
Article Number 20903
Number of page(s) 11
Section Physics of Energy Transfer, Conversion and Storage
DOI https://doi.org/10.1051/epjap/2019180288
Published online 15 October 2019
  1. Y. Developpement, Power module packaging – material market and technology trends 2017, www.yole.fr (2017) [Google Scholar]
  2. T. Kimoto, K. Kawahara, H. Niwa, N. Kaji, J. Suda, Ion implantation technology in SiC for power device applications, in International Workshop on Junction Technology (IWJT) (2014) pp. 1–6 [Google Scholar]
  3. S. Ryu, C. Capell, C. Jonas, Y. Lemma, M. O’Loughlin, J. Clayton, E. Van Brunt, K. Lam, J. Richmond, A. Burk et al., Ultra high voltage IGBTs in 4H-SiC, in 1st Workshop on Wide Bandgap Power Devices and Applications (2013), pp. 36–39 [CrossRef] [Google Scholar]
  4. S. Madhusoodhanan, K. Hatua, S. Bhattacharya, S. Leslie, S.H. Ryu, M. Das, A. Agarwal, D. Grider, Comparison study of 12 kV n-type SiC IGBT with 10kV SiC MOSFET and 6.5kV Si IGBT based on 3L-NPC VSC applications, in Energy Conversion Congress and Exposition (ECCE) (IEEE, 2012), pp. 310–317 [Google Scholar]
  5. H. Miyake, T. Okuda, H. Niwa, T. Kimoto, J. Suda, IEEE Electr. Device Lett. 33, 1598 (2012) [CrossRef] [Google Scholar]
  6. H. Masafumi, I. Yuji, I. Yoshinari, Packaging technologies for SiC power modules, Fuji Electric Review (2012) [Google Scholar]
  7. L. Ménager, B. Allard, V. Bley, Conditionnement des modules de puissance, Techniques de l’ingénieur Électronique de puissance: conversion etgestion 2010 [Google Scholar]
  8. CREE, Sic custom power services, www.wolfspeed.com (2017) [Google Scholar]
  9. T. Negishi, R. Tsuda, K. Ota, S. Iura, H. Yamaguchi, 3.3-kV All-SiC Power Module for Traction System Use, in International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (PCIM Europe, 2017), pp. 1–6 [Google Scholar]
  10. H. Hourdequin, PhD thesis, Toulouse University, 2018 [Google Scholar]
  11. N. Wang, I. Cotton, J. Robertson, S. Follman, K. Evans, D. Newcombe, IEEE Trans. Dielectr. Electr. Insul. 17, 1319 (2010) [Google Scholar]
  12. J. Zhou, S. Ang, A. Mantooth, J.C. Balda, A nano-composite polyamide imide passivation for 10 kV power electronics modules, in Energy Conversion Congress and Exposition (ECCE) (2012) 4262–4266 [Google Scholar]
  13. G. Mitic, T. Licht, G. Lefranc, IGBT module technology with high partial discharge resistance, in Conference Record of the 2001 IEEE Industry Applications Conference. 36th IAS Annual Meeting (2001), Vol. 3, pp. 1899–1904 [Google Scholar]
  14. L. Donzel, J. Schuderer, IEEE Trans. Dielectr. Electr. Insul. 19, 955 (2012) [Google Scholar]
  15. M. Kozako, Z. Valdez-Nava, S. Diaham, S. Dinculescu, T. Lebey, Fundamental investigation of dielectric phenomena in epoxy composites during curing process under a uniform electric field, in Annual Report Conference on Electrical Insulation and Dielectric Phenomena CEIDP (2012), pp. 574–550 [Google Scholar]
  16. G. Belijar, S. Diaham, Z. Valdez-Nava, T. Lebey, J. Phys. D: Appl. Phys. 49 (2016) [Google Scholar]
  17. S. Diaham, Z. Valdez-Nava, L. Leveque, G. Belijar, L. Laudebat, T. Lebey, Method for processing an electrically insulating material providing same with self-adjusting electric field grading properties for electrical components, in International Patent PCT/EP2017/063740, CNRS/UPS/INUC, 6 June 2017, PCT/EP2017/063740 [Google Scholar]
  18. L. Leveque, PhD thesis, Toulouse University, 2017 [Google Scholar]
  19. M.T. Do, PhD thesis, Joseph-Fourier University - Grenoble I, 2008 [Google Scholar]
  20. D. Frey, J. Schanen, J. Auge, O. Lesaint, Electric field investigation in high voltage power modules using finite elementsimulations and partial discharge measurements, in 38th IAS Annual Meeting on Conference Record of the Industry Applications Conference (2003), Vol. 2, pp. 1000–1005 [CrossRef] [Google Scholar]
  21. H. Reynes, C. Buttay, H. Morel, Protruding ceramic substrates for high voltage packaging of wide bandgap semiconductors, in 5th Workshop on Wide Bandgap Power Devices and Applications (WiPDA) (2017), pp. 404–410 [Google Scholar]
  22. G. Betti Beneventi, M. DalRe, L. Vincetti, Adv. Electromagn. 7, 53 (2018) [CrossRef] [Google Scholar]
  23. C. Bayer, E. Baer, U. Waltrich, D. Malipaard, A. Schletz, IEEE Trans. Dielectr. Electr. Insul. 22, 257 (2015) [Google Scholar]
  24. H. Hourdequin, L. Laudebat, M.L. Locatelli, P. Bidan, Design of packaging structures for high voltage power electronics devices: Electric field stress on insulation, in International Conference on Dielectrics (ICD) (2016), pp. 999–1002 [CrossRef] [Google Scholar]
  25. M.L. Griffith, J.W. Halloran, J. Am. Ceram. Soc. 79, 2601 (2005) [Google Scholar]
  26. U. Lakshminarayan, S. Ogrydiziak, H. Marcus, Selective Laser Sintering of Ceramic Materials, in International Solid Freeform Fabrication Symposium (University of Texas, 1990), pp. 16–26 [Google Scholar]
  27. N. Travitzky, A. Bonet, B. Dermeik, T. Fey, I. Filbert-Demut, L. Schlier, T. Schlordt, P. Greil, Adv. Eng. Mater. 16, 729 (2014) [Google Scholar]
  28. M. Goetz, N. Kuhn, B. Lehmeier, A. Meyer, U. Voller, Comparison of Silicon Nitride DBC and AMB Substrates for Different Applications in Power Electronics, in Power Electronics Conference PCIM (2013), Vol. 1, pp. 57–65 [Google Scholar]
  29. A. Miric, P. Dietrich, H. Germany, Inorganic substrates for power electronics applications (Heraeus Group, 2015) [Google Scholar]
  30. P. Laurens, C. Dubouchet, D. Kechemair, Application des lasers aux traitements de surface (Techniques de l’ingénieur: Maériaux, 1996) [Google Scholar]
  31. M. Decup, PhD thesis, Toulouse University - Toulouse III, 2010 [Google Scholar]

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