| Issue |
Eur. Phys. J. Appl. Phys.
Volume 46, Number 1, April 2009
International Symposium on Flexible Organic Electronics (IS-FOE)
|
|
|---|---|---|
| Article Number | 12503 | |
| Number of page(s) | 5 | |
| Section | Topical Issue International Symposium on Flexible Organic Electronics (IS-FOE) | |
| DOI | https://doi.org/10.1051/epjap/2009027 | |
| Published online | 10 March 2009 | |
https://doi.org/10.1051/epjap/2009027
Femtosecond laser machining and lamination for large-area flexible organic microfluidic chips
Laboratoire FEMTO-ST/Dpt. MN2S, CNRS UMR 6174, 32 Av. de l'Observatoire, 25044 Besançon, France
Corresponding author: chantal.khan-malek@femto-st.fr
Received:
20
October
2008
Accepted:
23
January
2009
Published online:
10
March
2009
A hybrid process compatible with reel-to-reel manufacturing is developed for ultra low-cost large-scale manufacture of disposable microfluidic chips. It combines ultra-short laser microstructuring and lamination technology. Microchannels in polyester foils were formed using focused, high-intensity femtosecond laser pulses. Lamination using a commercial SU8-epoxy resist layer was used to seal the microchannel layer and cover foil. This hybrid process also enables heterogeneous material structuration and integration.
PACS: 87.85.Va – Micromachining / 81.05.Lg – Polymers and plastics; rubber; synthetic and natural fibers; organometallic and organic materials / 87.85.Ox – Biomedical instrumentation and transducers, including micro-electro-mechanical systems (MEMS)
© EDP Sciences, 2009
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