Eur. Phys. J. Appl. Phys.
Volume 44, Number 2, November 2008
|Page(s)||143 - 148|
|Section||Surfaces, Interfaces and Films|
|Published online||04 October 2008|
An improved electroforming process for Ni–Co–Mn deposition using synchronized electric and magnetic impulse
Ph.D. Student, Graduate School of Engineering Science and Technology, National
Yunlin University of Science and Technology,
8F, 41-3, Sinyi Road Sec. 3, Taipei, Taiwan 10631, P.R. China
2 Associate Professor, Graduate School of Engineering Science and Technology, National Yunlin University of Science and Technology, 8F, 41-3, Sinyi Road Sec. 3, Taipei, Taiwan 10631, P.R. China
Corresponding author: firstname.lastname@example.org
Revised: 23 June 2008
Accepted: 27 June 2008
Published online: 4 October 2008
The use of additives which raises the density of metal-ion in electroforming solution and the application of impulse current are the common methods to improve the deposition rate of electroforming and to ameliorate the mechanical characteristics of electroforming layer. However, our study reveals that it is possible to obtain better results by tailoring the flow rate of the electrolyte and the relative intensity of the electric and applied magnetic fields. The MHD (Magnetohydrodynamic) effect arising from the application of an external magnetic field can have remarkable influence on the crystal behavior, giving more consolidated textures while providing higher deposition rate and better mechanical properties of the Ni–Co–Mn alloy.
PACS: 81.15.Pq – Electrodeposition, electroplating / 68.55.J- – Morphology of films
© EDP Sciences, 2008
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