Issue |
Eur. Phys. J. Appl. Phys.
Volume 39, Number 2, August 2007
NUMELEC 2006
|
|
---|---|---|
Page(s) | 85 - 94 | |
Section | Surfaces, Interfaces and Films | |
DOI | https://doi.org/10.1051/epjap:2007098 | |
Published online | 13 June 2007 |
https://doi.org/10.1051/epjap:2007098
Electroforming simulations based on the level set method
1
ELSYCA NV, Z.1. Researchpark, 310 1731 Zellik, Belgium
2
Vrije Universiteit Brussel, Department
of Electrical Engineering, Pleinlaan 2, 1050 Brussels, Belgium
Corresponding author: marius.purcar@elsyca.com
Received:
18
January
2007
Accepted:
17
April
2007
Published online:
13
June
2007
This paper proposes a general applicable numerical algorithm for the simulation of two dimensional electrode shape changes during electroforming processes. The computational model consists of two coupled problems: electrode shape change rate computation and a moving boundary problem. The innovative aspect is that the electrode shape is computed over a number of predefined time steps by convection of its surface proportional with and in the direction of the local growth rate. Validation of the electrode growth algorithm is made by comparison with experimental results obtained for the electrode growth in the vicinity of a singularity (incident angle between the electrode and insulator = 180°). Finally an example related to the plating of two adjacent wires in order to demonstrate the strong features of the applied method will be presented.
PACS: 02.70.Dh – Finite-element and Galerkin methods / 41.20.Cv – Electrostatics; Poisson and Laplace equations, boundary-value problems
© EDP Sciences, 2007
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