Eur. Phys. J. Appl. Phys.
Volume 35, Number 1, July 2006
|Page(s)||17 - 27|
|Section||Surfaces, Interfaces and Films|
|Published online||23 June 2006|
CuO thin films thermal conductivity and interfacial thermal resistance estimation
Laboratoire inter établissement `TRansferts Écoulements Fluides
Énergétique', UMR 8508, École Nationale Supérieure d'Arts et
Métiers, Esplanade des Arts et Métiers, 33405 Talence Cedex, France
2 Institut de Chimie de la Matière Condensée de Bordeaux, UPR-CNRS 9048, 87 avenue du Docteur Schweitzer, 33608 Pessac Cedex, France
Corresponding author: email@example.com
Revised: 8 March 2006
Accepted: 9 April 2006
Published online: 23 June 2006
The thermal conductivity and the interface thermal contact resistance of four different in thickness CuO films, obtained by PVD on a tungsten carbide substrate were investigated with a developed modulated photothermal method based on infrared measurement. According to the knowledge of the substrate thermophysical properties, the gain between the thermal perturbation and the response of the sample was used as the experimental data. The results show the dependence of the effective longitudinal thermal conductivity on the film thickness. Scanning electron microscopy observations reveal the strong anisotropy and columnar structure of the deposits. Moreover, the chemical composition of films was tested. A similar composition for each film was also verified.
PACS: 68.60.-p – Physical properties of thin films, nonelectronic / 68.55.-a – Thin film structure and morphology
© EDP Sciences, 2006
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