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Observing In Situ Degradation of Metallized Aluminum Nitride Substrate by Acoustic Emission and Digital Image Correlation
Minh Chu Ngo, Hiroyuki Miyazaki, Kiyoshi Hirao, Tatsuki Ohji and Manabu Fukushima IEEE Transactions on Power Electronics 40(9) 13300 (2025) https://doi.org/10.1109/TPEL.2025.3564917
Navigating Strategies to Mitigate Insulation Issues Within High Power Density (U)WBG Power Module Packages: A Comprehensive Review Emphasizing Alternative Encapsulation Materials
Degradation induced by charge relaxation in silicone gels under the ultra‐fast pulsed electric field
Teng Gao, Dongxin He, Zhe Xu, Junyu Wei, Shijie Xie, Gilbert Teyssedre, Zhizhen Liu and Bin Cui High Voltage 9(6) 1383 (2024) https://doi.org/10.1049/hve2.12484
Investigation of cooling capability of ceramic substrates for power electronics applications
An Integrated Structure–Material Optimization Strategy for the Packaging of High-Voltage Insulated Gate Bipolar Transistors
Lipeng Zhong, Wei Liu, Yingwei Xi, Feng Wang, She Chen, Qiuqin Sun, Youqing Sun and Guanghai Fei IEEE Transactions on Dielectrics and Electrical Insulation 29(6) 2163 (2022) https://doi.org/10.1109/TDEI.2022.3211225
Innovative ceramic-matrix composite substrates with tunable electrical conductivity for high-power applications
Driss Kenfaui, Zarel Valdez-Nava, Lionel Laudebat, Marie-Laure Locatelli, Céline Combettes, Vincent Bley, Sorin Dinculescu, Christophe Tenailleau, Pascal Dufour and Sophie Guillemet-Fritsch Science and Technology of Advanced Materials 23(1) 735 (2022) https://doi.org/10.1080/14686996.2022.2137695
Electric Field Mitigation in High-Voltage High-Power IGBT Modules Using Nonlinear Conductivity Composites
Kaixuan Li, Boya Zhang, Xingwen Li, Feifei Yan and Laili Wang IEEE Transactions on Components, Packaging and Manufacturing Technology 11(11) 1844 (2021) https://doi.org/10.1109/TCPMT.2021.3106962
Insulation Materials and Systems for Power Electronics Modules: A Review Identifying Challenges and Future Research Needs
Effects of Frequency and Temperature on Electric Field Mitigation Method via Protruding Substrate Combined with Applying Nonlinear FDC Layer in Wide Bandgap Power Modules