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Cited article:

Opportunities and challenges of 2D materials in back-end-of-line interconnect scaling

Chun-Li Lo, Benjamin A. Helfrecht, Yanbo He, David M. Guzman, Nicolas Onofrio, Shengjiao Zhang, Dana Weinstein, Alejandro Strachan and Zhihong Chen
Journal of Applied Physics 128 (8) (2020)
https://doi.org/10.1063/5.0013737

Improving Radio Frequency Transmission Properties of Graphene via Carrier Concentration Control toward High Frequency Transmission Line Applications

Jae Hoon Yang, Hyoung Woo Yang, Byoung Ok Jun, Jeong Hee Shin, Seunguk Kim, A‐Rang Jang, Seong In Yoon, Hyeon Suk Shin, Deoksoo Park, Kyungho Park, Duhee Yoon, Jung Inn Sohn, SeungNam Cha, Dae Joon Kang and Jae Eun Jang
Advanced Functional Materials 29 (18) (2019)
https://doi.org/10.1002/adfm.201808057

Cu Nanolines for RF Interconnects: Electrical Characterization

Panagiotis Sarafis, Chuan-Lu Hsu, Philippe Benech and Androula G. Nassiopoulou
IEEE Transactions on Electron Devices 62 (5) 1537 (2015)
https://doi.org/10.1109/TED.2015.2409478