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All issues Eur. Phys. J. Appl. Phys., 54 1 (2011) 11302 Article references

Articles citing this article

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Cited article:

Modelling wetting angle of solder on substrate using machine learning approach

Bing-Xi Lee and Yu-chen Liu
Science and Technology of Welding and Joining 30 (2) 129 (2025)
https://doi.org/10.1177/13621718241310935

A new approach for measuring the wetting angles of lead-free solder alloys from digital images

Eftal Sehirli, Ahmet Mustafa Erer and Muhammed Kamil Turan
Engineering Science and Technology, an International Journal 36 101279 (2022)
https://doi.org/10.1016/j.jestch.2022.101279

Numerical computation of wetting angles of Sn–(3−x)Ag–0.5Cu−x(Bi,In) quaternary Pb-free solder alloy systems on Cu substrate

Ahmet Mustafa Erer and Mukaddes Ökten Turacı
International Journal of Modern Physics C 31 (09) 2050119 (2020)
https://doi.org/10.1142/S0129183120501193

Metal–Metal Joining Using Super-Spread Wetting into Interface Fine Mesh Structure

Jaebong Yeon, Yen-Man Yen, Masashi Nakamoto and Toshihiro Tanaka
MATERIALS TRANSACTIONS (2018)
https://doi.org/10.2320/matertrans.MAW201804