Eur. Phys. J. Appl. Phys.
Volume 54, Number 1, April 2011
|Number of page(s)||4|
|Section||Surfaces and Interfaces|
|Published online||13 April 2011|
Measurement and prediction of contact angles of Pb-free Sn-Ag solder alloys on Cu substrate
Department of Physics, Karabuk University, 78200 Karabuk, Turkey
2 Department of Mechanical and Manufacturing Engineering, Bilecik University, Gulumbe Kampusu, 11210 Bilecik, Turkey
3 Department of Physics, Zonguldak Karaelmas University, 67100 Zonguldak, Turkey
4 Department of Metals, Karabuk University, 78200 Karabuk, Turkey
Corresponding author: email@example.com
Accepted: 7 February 2011
Published online: 13 April 2011
The contact angle (Θ) of molten Sn and Sn-Ag alloys (0.5, 1.5, 3.5, 6 wt.% Ag) on Cu substrates have been studied by using sessile drop method at various temperatures (230, 250, 275 and 300 °C). Experimental results showed that additions of Ag to Sn resulted in a continuous decrease in the Θ up to 3.5 wt.% above which the Θ value was increased. Increasing alloy temperature also decreased the Θ proportionally. Experimental results revealed that a correlation between the Θ, alloy composition and the alloy temperature exists which yielded an empirical model to predict the Θ at a given Ag content and temperature for a given Sn-Ag alloy. The empirical model predicts the Θ reasonably well with the present work and the other published works.
© EDP Sciences, 2011
Current usage metrics show cumulative count of Article Views (full-text article views including HTML views, PDF and ePub downloads, according to the available data) and Abstracts Views on Vision4Press platform.
Data correspond to usage on the plateform after 2015. The current usage metrics is available 48-96 hours after online publication and is updated daily on week days.
Initial download of the metrics may take a while.