Measurement and prediction of contact angles of Pb-free Sn-Ag solder alloys on Cu substrate

¹ Department of Physics, Karabuk University, 78200 Karabuk, Turkey
² Department of Mechanical and Manufacturing Engineering, Bilecik University, Gulumbe Kampusu, 11210 Bilecik, Turkey
³ Department of Physics, Zonguldak Karaelmas University, 67100 Zonguldak, Turkey
⁴ Department of Metals, Karabuk University, 78200 Karabuk, Turkey

Corresponding author: ecandan@yahoo.com

Received: 6 December 2010
Accepted: 7 February 2011
Published online: 13 April 2011

Abstract

The contact angle (Θ) of molten Sn and Sn-Ag alloys (0.5, 1.5, 3.5, 6 wt.% Ag) on Cu substrates have been studied by using sessile drop method at various temperatures (230, 250, 275 and 300 °C). Experimental results showed that additions of Ag to Sn resulted in a continuous decrease in the Θ up to 3.5 wt.% above which the Θ value was increased. Increasing alloy temperature also decreased the Θ proportionally. Experimental results revealed that a correlation between the Θ, alloy composition and the alloy temperature exists which yielded an empirical model to predict the Θ at a given Ag content and temperature for a given Sn-Ag alloy. The empirical model predicts the Θ reasonably well with the present work and the other published works.