Regular Article

A method coupling modified vector potential A* and homogenization formulations to model short-circuits in lamination stacks

Univ. Lille, Centrale Lille, Arts et Métiers Paris Tech, HEI, EA 2697 – L2EP – Laboratoire d’Electrotechnique et d’Electronique de Puissance, 59000 Lille, France

^a e-mail: smail.ziani@ed.univ-lille1.fr

Received: 20 January 2016
Revised: 12 April 2016
Accepted: 11 July 2016
Published online: 2 August 2016

Abstract

In this paper a method in 2-D frequency domain is presented to simulate a laminated iron core with a short-circuit between several magnetic sheets. The approach consists in coupling homogenization methods and finite element method. The defect is modeled with A* modified vector potential formulation and the rest of the structure with a homogenization method. The coupled method is applied to a lamination stack containing a short-circuit and compared to the reference, where the A* formulation is applied on the whole domain. Finally, a thermal modeling of lamination stack is presented to study the influence of an insulating defect.