Issue |
Eur. Phys. J. Appl. Phys.
Volume 64, Number 1, October 2013
|
|
---|---|---|
Article Number | 11001 | |
Number of page(s) | 14 | |
Section | Instrumentation and Metrology | |
DOI | https://doi.org/10.1051/epjap/2013130179 | |
Published online | 03 October 2013 |
https://doi.org/10.1051/epjap/2013130179
Near-field coupling model between PCB and grounded transmission line based on plane wave spectrum
1
IRSEEM, EA 4353 - ESIGELEC, av. Galilée, BP 10024, 76801 St Etienne du Rouvray Cedex, France
2
CESI, IRISE Laboratory, 1 rue marconi, 76130 Mont Saint Aignan, France
a e-mail: blaise.ravelo@yahoo.fr
Received:
12
April
2013
Revised:
24
August
2013
Accepted:
30
August
2013
Published online:
3
October
2013
This article presents an explicit model of electromagnetic (EM) coupling between electronic circuits and metallic wire placed above the ground plane. The model is based on the interaction between the EM near-field (NF) that has been treated with plane wave spectrum (PWS) and the Taylor model. The routine process illustrating the methodology is addressed is this article. The practicability of the model developed was upheld with different analytical and real demonstrators. First, the NF coupling between a straight transmission line (TL) and 1 GHz Wilkinson power divider (PWD) designed and implemented in planar technology was provided. Subsequently, simulations with a powerful commercial tool and measurements from 0.2 GHz to 2 GHz revealed a good agreement between the coupling voltages from the proposed model. As a second proof of concept, a printed circuit board incorporating a 40 MHz RF oscillator was placed 5 mm above the grounded TL. Once again, coupling voltages matched measurements were observed with magnitude relative difference lower than 5 dB. The hereby model presents huge benefits not only in terms of flexibility in the design process but it can also be run with very less computation time compared to the existing standard simulators. The model can be potentially a good candidate for investigating complex systems EMC engineering.
© EDP Sciences, 2013
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