Dry plasma processing for industrial crystalline silicon solar cell production

Fraunhofer Institute for Solar Energy Systems, Dept. PTQ, Heidenhofstr. 2, 79110 Freiburg, Germany

Corresponding author: marc.hofmann@ise.fraunhofer.de

Received: 30 June 2009
Revised: 25 May 2010
Accepted: 23 June 2010
Published online: 22 September 2010

Abstract

This paper gives an overview on the standard crystalline silicon solar cell manufacturing processes typically applied in industry. Main focus has been put on plasma processes which can replace existing, mainly wet chemical processes within the standard process flow. Finally, additional plasma processes are presented which are suited for higher-efficient solar cells, i.e. for the “passivated emitter and rear cell” concept (PERC) or the “heterojunction with intrinsic thin layer” approach (HIT). Plasma processes for the deposition of thin dielectric or semiconducting layers for surface passivation, emitter deposition or anti-reflective coating purposes are presented. Plasma etching processes for the removal of phosphorus silicate glass or parasitic emitters, for wafer cleaning and masked and mask-free surface texturisation are discussed.