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Effect of cooling rate on structure and creep behavior of Sn-0.7Cu-0.5Zn lead-free solder alloy

E. S. Gouda

Eur. Phys. J. Appl. Phys., 48 2 (2009) 20902

Published online: 17 September 2009

DOI: 10.1051/epjap/2009139

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