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All issues Eur. Phys. J. Appl. Phys., 37 3 (2007) 299-305 Article references

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Comparison between hexatriacontane and stearic acid behaviours under late Ar―O2 post-discharge

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High Rate Etching of Polymers by Means of an Atmospheric Pressure Plasma Jet

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Interaction Mechanisms Between Ar–O2 Post-Discharge and Stearic Acid II: Behaviour of Thick Films

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Effect of Low-Pressure Nitrogen DC Plasma Treatment on the Surface Properties of Biaxially Oriented Polypropylene, Poly (Methyl Methacrylate) and Polyvinyl Chloride Films

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Production of N and O atoms in flowing Ar–N2–O2microwave discharges with separated N2and O2pulsed gases

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Influence of neutral and charged species on the plasma degradation of the stearic acid

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Significance of Hydrogen–Deuterium Exchange at Polyolefin Surfaces on Exposure to Ammonia Low-Pressure Plasma

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Increasing the Detection Limit of the Parkinson Disorder through a Specific Surface Chemistry Applied onto Inner Surface of the Titration Well

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The Plasma Chemistry of Polymer Surfaces

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Chemical sputtering of carbon films by simultaneous irradiation with argon ions and molecular oxygen

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Modification of stearic acid in Ar and Ar-O2 pulsed DC discharge

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STUDY ON SURFACE CHARGING EFFECT ON MASK DURING PLASMA ETCHING PROCESS THROUGH PARTICLE SIMULATION

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Exploring the Effects of Placement and Electron Angular Distribution on Two Adjacent Mask Holes During Plasma Etching Process

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Plasma Etching of Stearic Acid in Ar and Ar-O2 DC Discharges

E.A. Bernardelli, T. Souza, A.M. Maliska, Thierry Belmonte and M. Mafra
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Role of the Temperature on the Interaction Mechanisms Between Argon–Oxygen Post-Discharge and Hexatriacontane

M. Mafra, T. Belmonte, F. Poncin-Epaillard, A. S. da Silva Sobrinho and A. Maliska
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Exploring the evolution of asymmetric pattern of mask hole during plasma etching process by particle simulation method

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