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Cited article:
E. S. Gouda
Eur. Phys. J. Appl. Phys., 48 2 (2009) 20902
Published online: 2009-09-17
This article has been cited by the following article(s):
A study of microstructural development, hardness and micro-creep of Sn-3.5Ag-0.7Cu lead-free solder alloy prepared by rapid solidification
El Said Gouda
The European Physical Journal Plus 126 (9) 84 (2011)
DOI: 10.1140/epjp/i2011-11084-x
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Recent advances on Sn–Cu solders with alloying elements: review
Guang Zeng, Songbai Xue, Liang Zhang and Lili Gao
Journal of Materials Science: Materials in Electronics 22 (6) 565 (2011)
DOI: 10.1007/s10854-011-0291-3
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Effect of Ag-content on structure, corrosion behaviour and mechanical properties of Sn-9Zn lead-free solder alloy
El Said Gouda, H. Abdel Aziz, Y. El Gendy, F. Saad Allah and M. Hammam
The European Physical Journal Applied Physics 52 (3) 31302 (2010)
DOI: 10.1051/epjap/2010150
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Structure and Properties of Sn-9Zn Lead-Free Solder Alloy with Heat Treatment
Mahmoud Hammam, Fardos Saad Allah, El Said Gouda, Yaser El Gendy and Heba Abdel Aziz
Engineering 02 (03) 172 (2010)
DOI: 10.4236/eng.2010.23024
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Effect of TiO2 nanoparticle addition and cooling rate on microstructure and mechanical properties of novel Sn1.5Sb0.7Cu solders
C. H. Huang, Chin-Hsin Chen, S. Y. Chang, L. C. Tsao and R. S. Chen
Journal of Materials Science: Materials in Electronics 26 (6) 3493 (2015)
DOI: 10.1007/s10854-015-2860-3
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Effect of nano-TiO2 particles and cooling rate on the thermal, microstructure and mechanical properties of novel low-ag Sn1.5Sb1Ag solders
L.C. Tsao, S.Y. Cheng, C.W. Chen and Ting-Yu Chen
Materials Science and Engineering: A 658 159 (2016)
DOI: 10.1016/j.msea.2016.01.115
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Effect of the cooling rate in solidification on the electrical behavior of solder
Wenyi Yang and D. D. L. Chung
Journal of Materials Science: Materials in Electronics 32 (6) 7867 (2021)
DOI: 10.1007/s10854-021-05511-7
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