Articles citing this article

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Cited article:

Microstructure and properties of Sn-Ag and Sn-Sb lead-free solders in electronics packaging: a review

Xi Wang, Liang Zhang and Mu-lan Li
Journal of Materials Science: Materials in Electronics 33 (5) 2259 (2022)
https://doi.org/10.1007/s10854-021-07437-6

Vickers hardness, indentation creep and corrosion behaviour of Al-5Ti-1B alloy with copper content

El Said Gouda and Amira Nassar
The European Physical Journal Applied Physics 68 (2) 20701 (2014)
https://doi.org/10.1051/epjap/2014140219

A study of microstructural development, hardness and micro-creep of Sn-3.5Ag-0.7Cu lead-free solder alloy prepared by rapid solidification

El Said Gouda
The European Physical Journal Plus 126 (9) (2011)
https://doi.org/10.1140/epjp/i2011-11084-x

Structure and Properties of Sn-9Zn Lead-Free Solder Alloy with Heat Treatment

Mahmoud Hammam, Fardos Saad Allah, El Said Gouda, Yaser El Gendy and Heba Abdel Aziz
Engineering 02 (03) 172 (2010)
https://doi.org/10.4236/eng.2010.23024

Effect of Bi‐content on hardness and micro‐creep behavior of Sn‐3.5Ag rapidly solidified alloy

M. Kamal, El Said Gouda and L. K. Marei
Crystal Research and Technology 44 (12) 1308 (2009)
https://doi.org/10.1002/crat.200900414