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Effect of rapid thermal annealing on the mechanical stress and physico-chemical properties in plasma enhanced atomic layer deposited silicon nitride thin films
Antony Premkumar Peter, Alfonso Sepulveda Marquez, Johan Meersschaut, Praveen Dara, Timothee Blanquart, Takayama Tomomi, Ebisudani Taishi, Shiba Elichiro, Yosuke Kimura, Sander van Gompel and Pierre Morin Journal of Vacuum Science & Technology B 40(5) (2022) https://doi.org/10.1116/6.0001922
Impact of VUV photons on SiO2 and organosilicate low-k dielectrics: General behavior, practical applications, and atomic models
M. R. Baklanov, V. Jousseaume, T. V. Rakhimova, D. V. Lopaev, Yu. A. Mankelevich, V. V. Afanas'ev, J. L. Shohet, S. W. King and E. T. Ryan Applied Physics Reviews 6(1) (2019) https://doi.org/10.1063/1.5054304
Dielectric Barrier, Etch Stop, and Metal Capping Materials for State of the Art and beyond Metal Interconnects
Modeling stress development and hydrogen diffusion in plasma enhanced chemical vapor deposition silicon nitride films submitted to thermal cycles
Pierre Francois Morin, Bertrand Pelletier, Elise Laffosse and Lise Plantier Journal of Applied Physics 114(15) (2013) https://doi.org/10.1063/1.4826208
A two-step UV curing process for producing high tensile stressed silicon nitride layers
Fabrication of tunable clamped–clamped microresonators in silicon (1 1 0)
R van Leeuwen, P H R Lew, E W J M van der Drift, H S J van der Zant and W J Venstra Journal of Micromechanics and Microengineering 21(7) 075011 (2011) https://doi.org/10.1088/0960-1317/21/7/075011
Determination of silicon nitride film chemical composition to study hydrogen desorption mechanisms
Study of stress in tensile nitrogen-plasma-treated multilayer silicon nitride films
Pierre Morin, Gaetan Raymond, Daniel Benoit, Denis Guiheux, Roland Pantel, Fabien Volpi and Muriel Braccini Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 29(4) (2011) https://doi.org/10.1116/1.3602082