The Citing articles tool gives a list of articles citing the current article. The citing articles come from EDP Sciences database, as well as other publishers participating in CrossRef Cited-by Linking Program. You can set up your personal account to receive an email alert each time this article is cited by a new article (see the menu on the right-hand side of the abstract page).
Avoiding inelastic strains in solder joint interconnections of space electronics
E. Suhir ZAMM - Journal of Applied Mathematics and Mechanics / Zeitschrift für Angewandte Mathematik und Mechanik 103(2) (2023) https://doi.org/10.1002/zamm.202200097
Size effects on IMC growth of Cu/Ni/Sn-3.5Ag microbump joints during isothermal aging and prediction of shear strength using ANN
Chu Tang, Zhuo Chen, Mingang Fang, Xiaoyu Xiao, Gui Chen and Wenhui Zhu Journal of Materials Research and Technology 18 1865 (2022) https://doi.org/10.1016/j.jmrt.2022.03.110
Inhomogeneous Bonding in Low-TemperatureSoldering: Brief Review
Elevated Standoff Heights of Solder Joint Interconnections Can Result in Appreciable Stress and Warpage Relief
Ephraim Suhir, Sung Yi, Jennie S. Hwang and Reza Ghaffarian Journal of Microelectronics and Electronic Packaging 16(1) 13 (2019) https://doi.org/10.4071/imaps.735566
Flip-Chip (FC) and Fine-Pitch-Ball-Grid-Array (FPBGA) Underfills for Application in Aerospace Electronics—Brief Review
Expected stress relief in a bi-material inhomogeneously bonded assembly with a low-modulus-and/or-low-fabrication-temperature bonding material at the ends
Could application of column-grid-array (CGA) technology result in inelastic-strain-free state-of-stress in solder material?
Ephraim Suhir, Reza Ghaffarian and Johann Nicolics Journal of Materials Science: Materials in Electronics 26(12) 10062 (2015) https://doi.org/10.1007/s10854-015-3688-6