Articles citing this article

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Cited article:

Failure-oriented-accelerated-testing (FOAT) and its role in assuring electronics reliability: review

Suhir E
International Journal of Physics Research and Applications 6 (1) 001 (2023)
https://doi.org/10.29328/journal.ijpra.1001048

Analytical Modeling of Electronic and Photonic Materials Reliability: Perspective and Extension

E. Suhir
Journal of Engineering Materials and Technology 145 (3) (2023)
https://doi.org/10.1115/1.4062085

Avoiding inelastic strains in solder joint interconnections of space electronics

E. Suhir
ZAMM - Journal of Applied Mathematics and Mechanics / Zeitschrift für Angewandte Mathematik und Mechanik 103 (2) (2023)
https://doi.org/10.1002/zamm.202200097

Size effects on IMC growth of Cu/Ni/Sn-3.5Ag microbump joints during isothermal aging and prediction of shear strength using ANN

Chu Tang, Zhuo Chen, Mingang Fang, Xiaoyu Xiao, Gui Chen and Wenhui Zhu
Journal of Materials Research and Technology 18 1865 (2022)
https://doi.org/10.1016/j.jmrt.2022.03.110

Analytical thermal stress modeling in electronics and photonics engineering: Application of the concept of interfacial compliance

Ephraim Suhir
Journal of Thermal Stresses 42 (1) 29 (2019)
https://doi.org/10.1080/01495739.2018.1525331

Elevated Standoff Heights of Solder Joint Interconnections Can Result in Appreciable Stress and Warpage Relief

Ephraim Suhir, Sung Yi, Jennie S. Hwang and Reza Ghaffarian
Journal of Microelectronics and Electronic Packaging 16 (1) 13 (2019)
https://doi.org/10.4071/imaps.735566

Flip-Chip (FC) and Fine-Pitch-Ball-Grid-Array (FPBGA) Underfills for Application in Aerospace Electronics—Brief Review

Ephraim Suhir and Reza Ghaffarian
Aerospace 5 (3) 74 (2018)
https://doi.org/10.3390/aerospace5030074

Probabilistic Palmgren–Miner rule, with application to solder materials experiencing elastic deformations

E. Suhir, R. Ghaffarian and S. Yi
Journal of Materials Science: Materials in Electronics 28 (3) 2680 (2017)
https://doi.org/10.1007/s10854-016-5845-y

Solder material experiencing low temperature inelastic stress and random vibration loading: predicted remaining useful lifetime

E. Suhir, R. Ghaffarian and S. Yi
Journal of Materials Science: Materials in Electronics 28 (4) 3585 (2017)
https://doi.org/10.1007/s10854-016-5960-9

Expected stress relief in a bi-material inhomogeneously bonded assembly with a low-modulus-and/or-low-fabrication-temperature bonding material at the ends

E. Suhir
Journal of Materials Science: Materials in Electronics 27 (6) 5563 (2016)
https://doi.org/10.1007/s10854-016-4461-1

Bi-material assembly with a low-modulus-and/or-low-fabrication-temperature bonding material at its ends: optimized stress relief

E. Suhir
Journal of Materials Science: Materials in Electronics 27 (5) 4816 (2016)
https://doi.org/10.1007/s10854-016-4363-2

Could application of column-grid-array (CGA) technology result in inelastic-strain-free state-of-stress in solder material?

Ephraim Suhir, Reza Ghaffarian and Johann Nicolics
Journal of Materials Science: Materials in Electronics 26 (12) 10062 (2015)
https://doi.org/10.1007/s10854-015-3688-6