Articles citing this article

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Cited article:

Multiphysics design and fabrication of 3D electroplated VIA materials topographies for next generation energy and sensor technologies

Daniel C. Smallwood, Paul McCloskey and James F. Rohan
Materials & Design 221 111001 (2022)
https://doi.org/10.1016/j.matdes.2022.111001

Microfabricated Racetrack Inductors With Thin-Film Magnetic Cores for On-Chip Power Conversion

Daniel V. Harburg, Alex J. Hanson, Jizheng Qiu, et al.
IEEE Journal of Emerging and Selected Topics in Power Electronics 6 (3) 1280 (2018)
https://doi.org/10.1109/JESTPE.2018.2808375

Efficiency Comparison of Inductor-, Capacitor-, and Resonant-Based Converters Fully Integrated in CMOS Technology

Yoann Pascal and Gael Pillonnet
IEEE Journal on Emerging and Selected Topics in Circuits and Systems 5 (3) 421 (2015)
https://doi.org/10.1109/JETCAS.2015.2462016