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Cited article:

Effect of Ag addition on the microstructure and corrosion properties of Sn–9Zn lead-free solder

Cunji Pu, Caiju Li, Tinghao Dong, Yingde Miao, Peng Gao, Xin Zhang, Jubo Peng and Jianhong Yi
Journal of Materials Research and Technology 27 6400 (2023)
https://doi.org/10.1016/j.jmrt.2023.11.123

Corrosion characterization of Sn-Zn solder: a review

Muhammad Firdaus Mohd Nazeri, Muhamad Zamri Yahaya, Ali Gursel, et al.
Soldering & Surface Mount Technology 31 (1) 52 (2019)
https://doi.org/10.1108/SSMT-05-2018-0013

Interfacial structure and growth kinetics of intermetallic compounds between Sn-3.5Ag solder and Al substrate during solder process

Yao Yao, Jian Zhou, Feng Xue and Xu Chen
Journal of Alloys and Compounds 682 627 (2016)
https://doi.org/10.1016/j.jallcom.2016.04.263

A study of microstructural development, hardness and micro-creep of Sn-3.5Ag-0.7Cu lead-free solder alloy prepared by rapid solidification

El Said Gouda
The European Physical Journal Plus 126 (9) (2011)
https://doi.org/10.1140/epjp/i2011-11084-x