Articles citing this article

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Cited article:

Sliding contacts on printed circuit boards and wear behavior

J.-P. Le Solleu

Eur. Phys. J. Appl. Phys., 50 1 (2010) 12902

Published online: 2010-02-26

DOI: https://doi.org/10.1051/epjap/2010020

This article has been cited by the following article(s):

Electrochemical Migration Behavior of Copper-Clad Laminate and Electroless Nickel/Immersion Gold Printed Circuit Boards under Thin Electrolyte Layers

Pan Yi, Kui Xiao, Kangkang Ding, Chaofang Dong and Xiaogang Li
Materials 10 (2) 137 (2017)
https://doi.org/10.3390/ma10020137