Issue Eur. Phys. J. Appl. Phys. Volume 46, Number 1, April 2009 International Symposium on Flexible Organic Electronics (IS-FOE) Article Number 12503 Number of page(s) 5 Section Topical Issue International Symposium on Flexible Organic Electronics (IS-FOE) DOI 10.1051/epjap/2009027 Published online 10 March 2009

Eur. Phys. J. Appl. Phys. 46, 12503 (2009)
DOI: 10.1051/epjap/2009027

Femtosecond laser machining and lamination for large-area flexible organic microfluidic chips

C. Khan Malek, L. Robert and R. Salut

Laboratoire FEMTO-ST/Dpt. MN2S, CNRS UMR 6174, 32 Av. de l'Observatoire, 25044 Besançon, France

chantal.khan-malek@femto-st.fr

Received: 20 October 2008 / Accepted: 23 January 2009 / Published online: 10 March 2009

Abstract
A hybrid process compatible with reel-to-reel manufacturing is developed for ultra low-cost large-scale manufacture of disposable microfluidic chips. It combines ultra-short laser microstructuring and lamination technology. Microchannels in polyester foils were formed using focused, high-intensity femtosecond laser pulses. Lamination using a commercial SU8-epoxy resist layer was used to seal the microchannel layer and cover foil. This hybrid process also enables heterogeneous material structuration and integration.

PACS
87.85.Va - Micromachining.
81.05.Lg - Polymers and plastics; rubber; synthetic and natural fibers; organometallic and organic materials.
87.85.Ox - Biomedical instrumentation and transducers, including micro-electro-mechanical systems (MEMS).

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