Issue Eur. Phys. J. Appl. Phys. Volume 44, Number 2, November 2008 Page(s) 143 - 148 Section Surfaces, Interfaces and Films DOI 10.1051/epjap:2008160 Published online 04 October 2008

Eur. Phys. J. Appl. Phys. 44, 143-148 (2008)
DOI: 10.1051/epjap:2008160

An improved electroforming process for Ni–Co–Mn deposition using synchronized electric and magnetic impulse

T.-Y. Chen¹ and D.-C. Wang<sup>2

1</sup>  Ph.D. Student, Graduate School of Engineering Science and Technology, National Yunlin University of Science and Technology, 8F, 41-3, Sinyi Road Sec. 3, Taipei, Taiwan 10631, P.R. China
²  Associate Professor, Graduate School of Engineering Science and Technology, National Yunlin University of Science and Technology, 8F, 41-3, Sinyi Road Sec. 3, Taipei, Taiwan 10631, P.R. China

tychen3@moeaidb.gov.tw

Received: 9 May 2008 / Received in final form: 23 June 2008 / Accepted: 27 June 2008 / Published online: 4 October 2008

Abstract
The use of additives which raises the density of metal-ion in electroforming solution and the application of impulse current are the common methods to improve the deposition rate of electroforming and to ameliorate the mechanical characteristics of electroforming layer. However, our study reveals that it is possible to obtain better results by tailoring the flow rate of the electrolyte and the relative intensity of the electric and applied magnetic fields. The MHD (Magnetohydrodynamic) effect arising from the application of an external magnetic field can have remarkable influence on the crystal behavior, giving more consolidated textures while providing higher deposition rate and better mechanical properties of the Ni–Co–Mn alloy.

PACS
81.15.Pq - Electrodeposition, electroplating.
68.55.J- - Morphology of films.

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