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Eur. Phys. J. Appl. Phys. 47, 22820 (2009)
DOI: 10.1051/epjap/2009079
Deposition of functional hydrogenated amorphous carbon-nitride film (a-CN:H) using C2H4/N2 townsend dielectric barrier discharge
C. Sarra-Bournet1, 2, 3, 4, N. Gherardi1, 2, S. Turgeon3, G. Laroche3, 4 and F. Massines51 Université de Toulouse, UPS, INPT, LAPLACE – Laboratoire Plasma et Conversion d'Énergie, 118 route de Narbonne, 31062 Toulouse Cedex 9, France
2 CNRS, LAPLACE, 31062 Toulouse, France
3 University Hospital Research Center CHUQ, St-Francois d'Assise Hospital, 10 rue de l'Espinay, G1L3L5, Quebec, Canada
4 Surface Engineering Laboratory, CERMA, Department of Mining, Metallurgical and Materials Engineering, Université Laval, G1V 0A6, Quebec, Canada
5 CNRS, PROMES, Tecnosud, 66100 Perpignan, France
christian.sarra-bournet.1@ulaval.ca
Received: 6 January 2009 / Accepted: 2 March 2009 / Published online: 28 April 2009
Abstract
The present work is an investigation of the chemical
composition and growth profile of an hydrogenated amorphous carbon nitride
film (a-CN:H) deposited by atmospheric pressure Townsend discharge in
C2H4/N2. Various surface characterization techniques were
used to evaluate the coatings properties (X-ray Photoelectron Spectroscopy,
Fourier Transform Infrared Spectroscopy, Profilometry, Scanning Electron
Microscopy). The coating obtained presented a high N/C ratio and a high
concentration of N-functionalities. The results revealed two different
growth mechanisms depending on the residence time of the precursor
molecules; at first, the growth is mainly due to radicals then a powder
formation mechanism appears, therefore leading to different chemical
composition and surface properties.
52.80.Dy - Low-field and Townsend discharges .
52.77.Dq - Plasma-based ion implantation and deposition.
68.37.-d - Microscopy of surfaces, interfaces, and thin films.
68.55.-a - Thin film structure and morphology.
© EDP Sciences 2009
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