Technical University of Cluj-Napoca, Department of Electrical Engineering, G. Baritiu Street 26-28, 400020 Cluj-Napoca, Romania
This paper proposes a general applicable algorithm for the optimization of the current density distribution in the electrochemical cells using the insulating shields during the electroplating process. The innovative aspect is that the position of the insulating shield is displaced over a number of predefined time steps convecting its surface proportional with and in the direction of a well chosen rate provided by a genetic algorithm. The aim of this method is to develop a systematic modification of the insulating shield position in order to get a more uniform distribution of the current density, hence a more uniform deposited layer at the cathode. As the displacement of the insulating shield is performed with the Level Set Method, the re-meshing of the computational domain with finite elements is not required anymore. Finally an example related to the optimization of the current density distribution in the vicinity of a singularity (incident angle between the electrode and insulator = 180°), using an insulating shield, will be presented.
(Received August 04 2010)
(Revised March 10 2011)
(Accepted June 10 2011)
(Online publication September 28 2011)